Send your BOM and Gerbers. We review component availability, flag substitutions if needed, and return a firm quote within one business day.
We procure every line item from authorized distributors. One BOM, one order, one partner - no coordinating between a bare-board shop and a separate assembler.
Precision stencil printing deposits solder paste with tight, repeatable tolerances. Each paste deposit is inspected via SPI before boards enter the pick-and-place line.
Automated placement machines populate each board to your placement file. Fine-pitch components, QFNs, BGAs, and 0201s are within our normal production range.
Boards run through a profiled reflow oven with tightly controlled temperature ramp rates. Through-hole components (if any) follow a selective or wave solder process.
Every board passes inline AOI after reflow. The system checks for missing components, solder bridges, lifted leads, and polarity errors - catching defects before they leave the line.
Finished boards are packed in anti-static trays or bags, labeled per your spec, and shipped with a full traceability package including lot documentation and inspection records.
Defects cost more the later they're caught. Our process builds in verification at each handoff so issues surface before they compound.
Component reels and trays are verified against your BOM before they touch the line. Lot codes logged for full traceability.
Paste volume and alignment are measured after stencil printing. Boards with out-of-spec deposits are rejected before placement.
Automated optical inspection runs on every board. Missing parts, bridges, and polarity errors are flagged and corrected before the next stage.
BGA and other hidden-joint packages can be verified with X-ray inspection. Available on request for critical assemblies.
A trained technician reviews each lot before packaging. IPC-A-610 workmanship standards are our baseline.